ChanHoon Ko
5Patents
4h-index
5Co-inventors
39Inventor score
Filing activity: May 25, 2010 → Aug 30, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8217502B2 | Integrated circuit packaging system with multipart conductive pillars and method of manufacture thereof | Electricity | 126 | Active |
| US8304296B2 | Semiconductor packaging system with multipart conductive pillars and method of manufacture thereof | Electricity | 10 | Active |
| US8455300B2 | Integrated circuit package system with embedded die superstructure and method of manufacture thereof | Electricity | 10 | Active |
| US8530277B2 | Integrated circuit packaging system with package on package support and method of manufacture thereof | Electricity | 4 | Active |
| US9054098B2 | Integrated circuit packaging system with redistribution layer and method of manufacture thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.