Gas supply mechanism and substrate processing apparatus
US8221581B2 · kind B2 · utility
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0References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 27, 2008 |
| Grant date | Jul 17, 2012 |
| Priority date | — |
| Expiry date | May 18, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32449
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A processing gas supply hole is constituted with a gas outlet hole formed at an electrode plate and a gas injection hole formed at a processing gas supply mechanism main unit. At the gas injection hole, a processing gas having flowed in on the upstream side is injected toward the gas outlet hole through an injection opening of a nozzle portion disposed on the downstream side, so as to generate a suction force at a suction flow passage formed around the nozzle portion by taking advantage of the ejector defect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.