Method to substantially enhance shelf life of hygroscopic components and to improve nano-manufacturing process tool availablity
US8225927B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 11, 2010 |
| Grant date | Jul 24, 2012 |
| Priority date | — |
| Expiry date | Nov 11, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6831
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process has been developed that significantly reduces moisture absorption of components, resulting in a component which is less susceptible to moisture and adsorption/absorption effects to the components functionality. In one embodiment, a component having reduced susceptibility to moisture exposure includes a component disposed in an air-tight package, the component having a blocking gas disposed in pores on a surface of the component. In another embodiment, a method for preparing a component having reduced susceptibility to moisture exposure includes driving water from a component in a controlled environment, exposing the component in the controlled environment to a blocking gas, removing the component in the controlled environment, and optionally sealing the component in an air-tight package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.