Integrated circuit packaging system with interposer
US8227925B2 · kind B2 · utility
3Cited by
20References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2012 |
| Grant date | Jul 24, 2012 |
| Priority date | — |
| Expiry date | Feb 15, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit packaging system comprising: a base package substrate; a first integrated circuit die attached over the base package substrate; and an interposer having a recessed edge and a corner that extends to a singulation edge, the interposer mounted over the first integrated circuit die, the interposer having a recess gap between the recessed edge and the singulation edge.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.