Passivation layer surface topography modifications for improved integrity in packaged assemblies
US8236615B2 · kind B2 · utility
1Cited by
13References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2009 |
| Grant date | Aug 7, 2012 |
| Priority date | — |
| Expiry date | Jan 15, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A structure and method for producing the same is disclosed. The structure includes an organic passivation layer with solids suspended therein. Preferential etch to remove a portion of the organic material and expose portions of such solids creates enhanced surface roughness, which provides a significant advantage with respect to adhesion of that passivation layer to the packaging underfill material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.