Alexandre Blander
7Patents
1h-index
25Co-inventors
43Inventor score
Filing activity: Jul 19, 2007 → Oct 1, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8614900B2 | Grounded lid for micro-electronic assemblies | Emerging Cross-Sectional Technologies | 3 | Active |
| US8493746B2 | Additives for grain fragmentation in Pb-free Sn-based solder | Emerging Cross-Sectional Technologies | 1 | Active |
| US8236615B2 | Passivation layer surface topography modifications for improved integrity in packaged assemblies | Electricity | 1 | Active |
| US8786059B2 | Passivation layer surface topography modifications for improved integrity in packaged assemblies | Electricity | 1 | Active |
| US7512518B2 | Method for measuring thin layers in solid state devices | Physics | 0 | Active |
| US9042120B2 | Grounded lid for micro-electronic assemblies | Emerging Cross-Sectional Technologies | 0 | Active |
| US8910853B2 | Additives for grain fragmentation in Pb-free Sn-based solder | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.