Method and apparatus for cooling an integrated circuit
US8237263B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 31, 2009 |
| Grant date | Aug 7, 2012 |
| Priority date | — |
| Expiry date | Nov 5, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An integrated circuit, a method of operating the integrated circuit, and a method of fabricating the integrated circuit are disclosed. According to one of the broader forms of the invention, a method and apparatus involve an integrated circuit that includes a heat transfer structure having a chamber that has a fluid disposed therein and that extends between a heat generating portion and a heat absorbing portion. Heat is absorbed into the fluid from the heat generating portion, and the fluid changes from a first phase to a second phase different from the first phase when the heat is absorbed. Heat is released from the fluid to the heat absorbing portion, and the fluid changes from the second phase to the first phase when the heat is released.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.