Method for making a stackable package
US8252629B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2010 |
| Grant date | Aug 28, 2012 |
| Priority date | — |
| Expiry date | Oct 2, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a method for making a stackable package. The method includes the following steps: (a) providing a first carrier; (b) disposing at least one chip on the first carrier; (c) forming a molding compound so as to encapsulate the chip; (d) removing the first carrier; (e) forming a first redistribution layer and at least one first bump; (f) providing a second carrier; (g) disposing on the second carrier; (h) removing part of the chip and part of the molding compound; (i) forming a second redistribution layer; and (j) removing the second carrier. Therefore, the second redistribution layer enables the stackable package to have more flexibility to be utilized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.