Patent · US Active

Device including semiconductor chip and leads coupled to the semiconductor chip and manufacturing thereof

US8253225B2 · kind B2 · utility

3Cited by

6References

19Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Ralf Otremba · Kaufbeuren, DE
Marco Seibt · Villach, AT
Uwe Kirchner · Feldkirchen in Kärnten, AT
Wolfgang Peinhopf · Klagenfurt, AT
Michael Treu · Villach, AT
Andreas Schloegl · Ottobrunn, DE
Mario Feldvoss · Munich, DE

Key dates

Filing date	Feb 22, 2008
Grant date	Aug 28, 2012
Priority date	—
Expiry date	Apr 3, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic device and manufacturing thereof. One embodiment provides a semiconductor chip having a control electrode and a first load electrode on a first surface and a second load electrode on a second surface. A first lead is electrically coupled to the control electrode. A second lead is electrically coupled to the first load electrode. A third lead is electrically coupled to the first load electrode, the third lead being separate from the second lead. A fourth lead is electrically coupled to the second load electrode, the second and third leads being arranged between the first and fourth leads.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.