Patent · US Active

Module including a sintered joint bonding a semiconductor chip to a copper surface

US8253233B2 · kind B2 · utility

0Cited by

7References

24Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Karsten Guth · Soest, DE
Ivan Nikitin · Regensburg, DE

Key dates

Filing date	Feb 14, 2008
Grant date	Aug 28, 2012
Priority date	—
Expiry date	Dec 4, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A module includes a substrate including a first copper surface and a semiconductor chip. The module includes a first sintered joint bonding the semiconductor chip directly to the first copper surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.