Stub minimization for multi-die wirebond assemblies with orthogonal windows
US8254155B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 20, 2012 |
| Grant date | Aug 28, 2012 |
| Priority date | — |
| Expiry date | Jan 20, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic assembly can include first and second microelectronic packages mounted to opposed surfaces of a circuit panel. Each package can include a substrate having first, second, and third apertures extending therethrough, first, second, and third microelectronic elements each having a surface facing the first surface of the substrate and a plurality of contacts aligned with at least one of the apertures, a plurality of terminals exposed at the second surface in a central region thereof, and leads connected between the contacts of each microelectronic element and the terminals. The apertures of each substrate can have first, second, and third axes extending in directions of their lengths. The first and second axes can be parallel to one another. The third axis can be transverse to the first and second axes. The terminals of each package can be configured to carry all of the address signals transferred to the respective package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.