Semiconductor package system with fine pitch lead fingers and method of manufacturing thereof
US8256660B2 · kind B2 · utility
0Cited by
34References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2011 |
| Grant date | Sep 4, 2012 |
| Priority date | — |
| Expiry date | Mar 21, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15747
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package system, and method of manufacturing thereof, includes: a die having a contact pad; a lead finger having a substantially trapezoidal cross-section; a bump clamped on a top and a side of the lead finger, the bump connected to the contact pad; and an encapsulant over the lead finger and the die, the encapsulant with a bottom of the lead finger exposed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.