Electrode orientation and parallelism adjustment mechanism for plasma processing systems
US8257548B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 3, 2008 |
| Grant date | Sep 4, 2012 |
| Priority date | — |
| Expiry date | Apr 12, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32091
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A mechanism for adjusting an orientation of an electrode in a plasma processing chamber is disclosed. The plasma processing chamber may be utilized to process at least a substrate, which may be inserted into the plasma processing chamber in an insertion direction. The mechanism may include a support plate disposed outside a chamber wall of the plasma processing chamber and pivoted relative to the chamber wall. The support plate may have a first thread. The mechanism may also include an adjustment screw having a second thread that engages the first thread. Turning the adjustment screw may cause translation of a portion of the support plate relative to the adjustment screw. The translation of the portion of the support plate may cause rotation of the support plate relative to the chamber wall, thereby rotating the electrode with respect to an axis that is orthogonal to the insertion direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.