Electroless plating-liquid system

US8257781B1 · kind B1 · utility

Assignee

• Novellus Systems, Inc. · US

Inventors

• Eric G. Webb · West Linn, US
• Steven T. Mayer · Lake Oswego, US
• David Mark Dinneen · Portland, US
• Edmund Minshall · Sherwood, US
• Christopher M. Bartlett · Beaverton, US
• R. Marshall Stowell · Wilsonville, US
• Mark T. Winslow · Camas, US
• Avishai Kepten · Jerusalem, IL
• Jingbin Feng · Tigard, US
• Norman D. Kaplan · Portland, US
• Richard Kevin Lyons · Lake in the Hills, US
• John B. Alexy · West Linn, US

Key dates

• Filing date: Aug 11, 2005
• Grant date: Sep 4, 2012
• Expiry date: Aug 22, 2028

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/76841
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A main reservoir holds cool reactant liquid. A reaction vessel for treating a substrate is connected to the main reservoir by a feed conduit. A heater is configured to heat reactant liquid in the feed conduit before the liquid enters the reaction vessel. Preferably, the heater is a microwave heater. A recycle conduit connects the reaction vessel with the main reservoir. Preferably, a recycle cooler cools reactant liquid in the recycle conduit before the liquid returns to the main reservoir. Preferably, an accumulation vessel is integrated in the feed conduit for accumulating, heating, conditioning and monitoring reactant liquid before it enters the reaction vessel. Preferably, a recycle accumulator vessel is integrated in the recycle conduit to accommodate reactant liquid as it empties out of the reaction vessel.