Package-on-package system with via z-interconnections and method for manufacturing thereof
US8258008B2 · kind B2 · utility
3Cited by
8References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2010 |
| Grant date | Sep 4, 2012 |
| Priority date | — |
| Expiry date | Dec 16, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a package-on-package system includes: providing an interposer substrate; mounting a base substrate under the interposer substrate and having a first integrated circuit die connected thereto; forming an encapsulant between the interposer substrate and the base substrate, the encapsulant encapsulating the first integrated circuit die; and forming a via z-interconnection extending through the encapsulant and one of the substrates to the other of the substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.