Integrated circuit assembly having vented heat-spreader
US8258013B1 · kind B1 · utility
6Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 12, 2010 |
| Grant date | Sep 4, 2012 |
| Priority date | — |
| Expiry date | Nov 7, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package assembly includes a substrate, a semiconductor die having opposing first and second surfaces, and a head-spreader. The semiconductor die is mounted on the substrate with the first surface facing the substrate. The heat-spreader includes a central region thermally coupled to the second surface of the semiconductor die, a flange region mounted on the substrate, and a side wall region between the central and flange regions. A cavity is formed between the heat-spreader, the substrate, and the semiconductor die. The heat-spreader has at least one vent extending from the cavity through the heat-spreader.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.