Thermocouple

US8262287B2 · kind B2 · utility

Assignee

• ASM America, Inc. · US

Inventors

• Buz Darabnia · Gilbert, US
• Andy Yednak · Phoenix, US
• Mike Halpin · Phoenix, US
• Loren Jacobs · Austin, US
• Ravinder Aggarwal · Gilbert, US

Key dates

• Filing date: Dec 8, 2008
• Grant date: Sep 11, 2012
• Expiry date: Jul 6, 2030

Classification

• Technology area (CPC G): Physics
• CPC primary: G01K13/00
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A thermocouple for use in a semiconductor processing reaction is described. The thermocouple includes a sheath having a measuring tip and an opening at the opposing end. A support member that receives a portion of a first wire and a second wire is received within the sheath. The first and second wires form a junction that contacts the inner surface of the sheath at the measuring tip. A spacing member is secured at the opening of the sheath and receives the support member. The spacing member allows the support member, first wire, and second wire to freely thermally expand relative to each other without introducing compression or tension stresses therein.