Workpiece holder for polishing, workpiece polishing apparatus and polishing method
US8268114B2 · kind B2 · utility
5Cited by
24References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2002 |
| Grant date | Sep 18, 2012 |
| Priority date | — |
| Expiry date | Jun 4, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A workpiece holder for polishing includes a workpiece holder body having multiple perforated holes to hold a workpiece by vacuum suction. A holding surface of the workpiece holder body may be coated with resin. A coefficient of thermal expansion of the resin coating on the holding surface may be 1×10−5/K or less. The resin coating on the holding surface may be epoxy resin filled with silica particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.