Compound, polymer, and resin composition
US8273837B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2006 |
| Grant date | Sep 25, 2012 |
| Priority date | — |
| Expiry date | Oct 26, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F220/382
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
A radiation-sensitive resin composition which has high transparency to radiation, excelling in basic properties as a resist such as sensitivity, resolution, and pattern shape, and, in particular, exhibiting high resolution performance, excellent DOF and LER, and high resistance to a liquid medium used in liquid immersion lithography is provided. Also provided are a polymer which can be used in the composition, a novel compound useful for synthesizing the polymer, and a method of producing the composition. A radiation-sensitive resin composition having an excellent resistance to a liquid medium can be obtained by using the novel compound shown by the following formula (1),wherein R1 represents a methyl group or a hydrogen atom, R2, R3 and R4 individually represent a substituted or unsubstituted monovalent organic group having 1 to 10 carbon atoms, n is an integer from 0 to 3, A represents a methylene group, a linear or branched alkylene group having 2 to 10 carbon atoms, or an arylene group, and X− represents a counter ion of S+.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.