RF shutter
US8281739B2 · kind B2 · utility
3Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 29, 2008 |
| Grant date | Oct 9, 2012 |
| Priority date | — |
| Expiry date | Jul 14, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/0206
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention generally comprises an RF shutter assembly for use in a plasma processing apparatus. The RF shutter assembly may reduce the amount of plasma creep below the substrate and shadow frame during processing, thereby reducing the amount of deposition that occurs on undesired surfaces. By reducing the amount of deposition on undesired surfaces, particle flaking and thus, substrate contamination may be reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.