Substrate processing apparatus, substrate processing method, substrate processing program, and computer readable recording medium having substrate processing program therein
US8282744B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 19, 2009 |
| Grant date | Oct 9, 2012 |
| Priority date | — |
| Expiry date | Feb 21, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is to supply processing liquid having a predetermined flow rate and concentration to substrate processing units of a substrate processing apparatus with high accuracy. The substrate processing apparatus, which processes substrates in the substrate processing units using the processing liquid supplied from a processing liquid supply part, sequentially carries the substrates to the respective substrate processing units, and controls the processing start time such that if the flow rate of the processing liquid used in one of the substrate processing units is less than the control flow rate that is controllable at the processing liquid supply part, the substrates are carried to the plurality of substrate processing units until a flow rate of the processing liquid reaches the control flow rate that is controllable at the processing liquid supply part and then the processing liquid is used simultaneously in the plurality of the substrate processing units.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.