Plated product having copper thin film formed thereon by electroless plating
US8283051B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2009 |
| Grant date | Oct 9, 2012 |
| Priority date | — |
| Expiry date | Jul 13, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12903
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A plated product made of a substrate having formed thereon an alloy barrier thin film for preventing copper diffusion contains metal B, which has barrier properties in relation to copper and enables displacement plating with the copper ions contained in an electroless copper plating solution, and metal A, which tends to have less ionization than metal B in an electroless copper plating solution at a pH of 10 or higher; the alloy barrier thin film for preventing copper diffusion has a composition wherein metal A constitutes between 15 and 35 at % of the atoms; and a copper thin film is formed on the alloy barrier thin film by electroless plating using an electroless copper plating solution at a pH of 10 or higher.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.