Multi-core processor and method of communicating across a die
US8284766B2 · kind B2 · utility
17Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2007 |
| Grant date | Oct 9, 2012 |
| Priority date | — |
| Expiry date | Aug 8, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A multi-core die is provided that allows packets to be communicated across the die using resources of a packet switched network and a circuit switched network.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.