Methods for correlating gap value to meniscus stability in processing of a wafer surface by a recipe-controlled meniscus
US8287656B2 · kind B2 · utility
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Key dates
| Filing date | Sep 22, 2011 |
| Grant date | Oct 16, 2012 |
| Priority date | — |
| Expiry date | Sep 22, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for monitoring meniscus processing of a wafer surface to stabilize a meniscus are provided. In one example, the processing is in response to a current recipe that defines a desired gap between the wafer surface and a proximity head. The method includes the operations of monitoring current meniscus processing to determine that a current gap is other than the desired gap, and identifying a calibration recipe that specifies the current gap. The method then continues the meniscus processing of the wafer surface using process parameters specified by the identified calibration recipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.