Apparatus and method of forming an applied film
US8287954B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2010 |
| Grant date | Oct 16, 2012 |
| Priority date | — |
| Expiry date | Aug 20, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6715
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided an apparatus including: a processing cup having an opening opened upward to allow a substrate to be loaded and unloaded, an exhaust port for exhausting an unnecessary atmosphere produced in forming a film applied on the substrate, and an aspiration port for aspirating external air; and an aspiration device aspirating the unnecessary atmosphere through the exhaust port, wherein when the substrate is accommodated in the opening of the processing cup, the substrate has a perimeter spaced from the opening by a predetermined gap, and below the substrate accommodated in the processing cup there is formed an exhaust flow path extending from the aspiration port to the exhaust port.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.