Semiconductor device and adhesive sheet
US8294282B2 · kind B2 · utility
2Cited by
1References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2010 |
| Grant date | Oct 23, 2012 |
| Priority date | — |
| Expiry date | Jan 13, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a semiconductor device which comprises a substrate, a first semiconductor chip on a substrate, a second semiconductor chip on the first semiconductor chip, and an adhesive sheet between the first and second semiconductor chips. The second semiconductor chip has a mirrored back surface, and the adhesive sheet contains a metal impurity ion trapping agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.