Semiconductor devices and methods of manufacturing thereof
US8298730B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2011 |
| Grant date | Oct 30, 2012 |
| Priority date | — |
| Expiry date | Mar 25, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor devices, methods of manufacturing thereof, lithography masks, and methods of designing lithography masks are disclosed. In one embodiment, a semiconductor device includes a plurality of first features disposed in a first material layer. At least one second feature is disposed in a second material layer, the at least one second feature being disposed over and coupled to the plurality of first features. The at least one second feature includes at least one void disposed between at least two of the plurality of first features.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.