Sun-Oo Kim
25Patents
8h-index
22Co-inventors
71Inventor score
Filing activity: Apr 21, 1998 → Aug 19, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6087278A | Method for fabricating semiconductor devices having an HDP-CVD oxide layer as a passivation layer | Emerging Cross-Sectional Technologies | 245 | Expired |
| US7052990B2 | Sealed pores in low-k material damascene conductive structures | Electricity | 22 | Expired |
| US7741715B2 | Crack stop and moisture barrier | Electricity | 18 | Expired |
| US7626268B2 | Support structures for semiconductor devices | Electricity | 14 | Active |
| US8004066B2 | Crack stop and moisture barrier | Electricity | 14 | Active |
| US7795615B2 | Capacitor integrated in a structure surrounding a die | Electricity | 13 | Active |
| US5968156A | Programmable peripheral component interconnect (PCI) bridge for interfacing a PCI bus and a local bus having reconstructable interface logic circuit therein | Physics | 8 | Expired |
| US7235454B2 | MIM capacitor structure and method of fabrication | Electricity | 8 | Active |
| US7879681B2 | Methods of fabricating three-dimensional capacitor structures having planar metal-insulator-metal and vertical capacitors therein | Electricity | 4 | Active |
| US7939942B2 | Semiconductor devices and methods of manufacturing thereof | Electricity | 4 | Active |
| US7235472B2 | Method of making fully silicided gate electrode | Electricity | 4 | Expired |
| US7041574B2 | Composite intermetal dielectric structure including low-k dielectric material | Emerging Cross-Sectional Technologies | 2 | Expired |
| US7112507B2 | MIM capacitor structure and method of fabrication | Electricity | 2 | Expired |
| US9194036B2 | Plasma vapor deposition | Electricity | 1 | Active |
| US7858448B2 | Method of forming support structures for semiconductor devices | Electricity | 1 | Active |
| US9437593B2 | Silicided semiconductor structure and method of forming the same | Electricity | 1 | Active |
| US7960811B2 | Semiconductor devices and methods of manufacture thereof | Electricity | 1 | Active |
| US7365025B2 | Methods of forming dual-damascene interconnect structures on semiconductor substrates using multiple planarization layers having different porosity characteristics | Electricity | 1 | Expired |
| US8197660B2 | Electro chemical deposition systems and methods of manufacturing using the same | Electricity | 0 | Active |
| US9425140B2 | Capacitors in integrated circuits and methods of fabrication thereof | Electricity | 0 | Active |
| US8817451B2 | Semiconductor devices and methods of manufacture thereof | Emerging Cross-Sectional Technologies | 0 | Active |
| US8748257B2 | Semiconductor devices and methods of manufacture thereof | Electricity | 0 | Active |
| US10008560B2 | Capacitors in integrated circuits and methods of fabrication thereof | Electricity | 0 | Active |
| US8298730B2 | Semiconductor devices and methods of manufacturing thereof | Electricity | 0 | Active |
| US7732315B2 | Methods of fabricating semiconductor devices and structures thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.