Substrate processing system
US8303232B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 17, 2009 |
| Grant date | Nov 6, 2012 |
| Priority date | — |
| Expiry date | May 7, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67769
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There are disposed two second substrate transferring apparatuses 60a and 60b, which are configured to transfer substrates W between substrate processing units 40 and a substrate accommodating part 30, in the up and down direction so as to correspond to the respective groups to which the plurality of substrate processing units 40 are divided. In addition, there is disposed a substrate displacing apparatus 35 that is configured to displace a substrate W, which has been transferred by a first substrate transferring apparatus 50 to the substrate accommodating part 30 and is not yet processed by the wafer processing unit 40, to another position in the up and down direction in the substrate accommodating part 30, as well as displace a substrate W, which has been processed by the wafer processing unit 40a and transferred by the second substrate transferring apparatus 60a to the substrate accommodating part 30, to another position in the up and down direction in the substrate accommodating part 30.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.