Substrate processing method and non-transitory storage medium for carrying out such method
US8303724B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2011 |
| Grant date | Nov 6, 2012 |
| Priority date | — |
| Expiry date | Aug 9, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67057
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a substrate processing apparatus for cleaning and drying a substrate such as a semiconductor wafer. This substrate processing apparatus includes a liquid processing unit for processing a substrate by immersing the substrate in stored purified water, a drying unit arranged above the liquid processing unit and configured to dry the substrate, a substrate transfer apparatus for transferring the substrate between the liquid processing unit and drying unit, a fluid supply mechanism for supplying a fluid mixture containing vapor or mist of purified water and vapor or mist of a volatile organic solvent to the drying unit, and a controller for controlling the supply of the fluid mixture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.