Semiconductor packaging system with multipart conductive pillars and method of manufacture thereof
US8304296B2 · kind B2 · utility
10Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2010 |
| Grant date | Nov 6, 2012 |
| Priority date | — |
| Expiry date | Feb 12, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of a semiconductor packaging system includes: providing a substrate; mounting a semiconductor chip to the substrate; mounting a pillar ball having a ball height electrically connected to the substrate; mounting an interposer above the semiconductor chip and electrically connected to the pillar ball; and wherein: mounting the interposer or mounting the substrate includes connecting the pillar ball to a pillar base having a base height substantially less than the ball height of the pillar ball and the pillar base having vertical sides not covered by the pillar ball.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.