Integrated circuit packaging system with package-on-package and method of manufacture thereof
US8304880B2 · kind B2 · utility
13Cited by
14References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2010 |
| Grant date | Nov 6, 2012 |
| Priority date | — |
| Expiry date | Dec 5, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a bottom substrate; mounting a bottom integrated circuit over the bottom substrate; mounting a top substrate over a side of the bottom integrated circuit opposite the bottom substrate; connecting a top interconnect between the bottom substrate and the top substrate; and forming an underfill layer between the bottom substrate and the top substrate, the underfill layer encapsulating the top interconnect outside a perimeter of the bottom integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.