Integrated circuit reliability
US8307319B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 2007 |
| Grant date | Nov 6, 2012 |
| Priority date | — |
| Expiry date | Jul 10, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing an integrated circuit having minimized electromigration effect, wherein the integrated circuit comprises one or more interconnect, said the or each interconnect comprising a dielectric layer having an intrinsic parameter at a first defined value, characterized in that said method comprises: identifying one or more characteristics of the or each interconnect; determining a minimal process distance from the or each interconnect for the application of one or more first metal elements; calculating a required correction parameter which can correct the intrinsic parameter at said first defined value; calculating a required number of the first metal elements which have the intrinsic parameter at a second defined value, such that the second defined value provides the required correction parameter for the first defined value; applying a plurality of said first metal elements around the interconnect at said minimum process distance to overcome the problem of electromigration caused by the intrinsic parameter at the first defined value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.