High throughput chemical mechanical polishing system
US8308529B2 · kind B2 · utility
41Cited by
12References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2009 |
| Grant date | Nov 13, 2012 |
| Priority date | — |
| Expiry date | Dec 3, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B41/005
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Embodiments of a system and method for polishing substrates are provided. In one embodiment, a polishing system is provided that includes a polishing module, a cleaner and a robot. The robot has a range of motion sufficient to transfer substrates between the polishing module and cleaner. The polishing module includes at least two polishing stations, at least one load cup and at least four polishing heads. The polishing heads are configured to move independently between the at least two polishing stations and the at least one load cup.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.