Method and apparatus for reduction of voltage potential spike during dechucking
US8313612B2 · kind B2 · utility
46Cited by
54References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2009 |
| Grant date | Nov 20, 2012 |
| Priority date | — |
| Expiry date | Mar 10, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a substrate dechucking system of a plasma processing chamber adapted to remove a substrate from an ESC with reduction in voltage potential spike during dechucking of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.