Yen-Kun Wang
25Patents
10h-index
57Co-inventors
78Inventor score
Filing activity: Mar 17, 1997 → Mar 27, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6148761A | Dual channel gas distribution plate | Electricity | 681 | Expired |
| US5866795A | Liquid flow rate estimation and verification by direct liquid measurement | Physics | 485 | Expired |
| US6176198A | Apparatus and method for depositing low K dielectric materials | Electricity | 265 | Expired |
| US8313612B2 | Method and apparatus for reduction of voltage potential spike during dechucking | Emerging Cross-Sectional Technologies | 46 | Active |
| US7335609B2 | Gap-fill depositions introducing hydroxyl-containing precursors in the formation of silicon containing dielectric materials | Electricity | 42 | Expired |
| US7456116B2 | Gap-fill depositions in the formation of silicon containing dielectric materials | Chemistry; Metallurgy | 37 | Expired |
| US7854820B2 | Upper electrode backing member with particle reducing features | Electricity | 26 | Active |
| US5968588A | In-situ liquid flow rate estimation and verification by sonic flow method | Chemistry; Metallurgy | 24 | Expired |
| US7722719B2 | Gas baffle and distributor for semiconductor processing chamber | Electricity | 14 | Expired |
| US7011710B2 | Concentration profile on demand gas delivery system (individual divert delivery system) | Chemistry; Metallurgy | 14 | Expired |
| US8492736B2 | Ozone plenum as UV shutter or tunable UV filter for cleaning semiconductor substrates | Emerging Cross-Sectional Technologies | 10 | Active |
| US7204888B2 | Lift pin assembly for substrate processing | Electricity | 10 | Expired |
| US6506994B2 | Low profile thick film heaters in multi-slot bake chamber | Electricity | 9 | Expired |
| US8895452B2 | Substrate support providing gap height and planarization adjustment in plasma processing chamber | Electricity | 7 | Active |
| US7192486B2 | Clog-resistant gas delivery system | Chemistry; Metallurgy | 6 | Expired |
| US8628675B2 | Method for reduction of voltage potential spike during dechucking | Emerging Cross-Sectional Technologies | 5 | Active |
| US8702866B2 | Showerhead electrode assembly with gas flow modification for extended electrode life | Electricity | 4 | Active |
| US8624210B2 | Ozone plenum as UV shutter or tunable UV filter for cleaning semiconductor substrates | Emerging Cross-Sectional Technologies | 3 | Active |
| US7841582B2 | Variable seal pressure slit valve doors for semiconductor manufacturing equipment | Fixed Constructions | 2 | Active |
| USRE47275E1 | Substrate support providing gap height and planarization adjustment in plasma processing chamber | General | 1 | Active |
| US7754282B2 | Adjusting a spacing between a gas distribution member and a substrate support | Electricity | 1 | Active |
| US8709202B2 | Upper electrode backing member with particle reducing features | Electricity | 1 | Active |
| US7205205B2 | Ramp temperature techniques for improved mean wafer before clean | Electricity | 0 | Expired |
| US9093483B2 | Showerhead electrode assembly with gas flow modification for extended electrode life | Electricity | 0 | Active |
| US12031885B2 | Leak detection for gas sticks | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.