Built-in compliance in test structures for leakage and dielectric breakdown of dielectric materials of metallization systems of semiconductor devices
US8314625B2 · kind B2 · utility
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5References
19Claims
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Key dates
| Filing date | Nov 18, 2009 |
| Grant date | Nov 20, 2012 |
| Priority date | — |
| Expiry date | Feb 6, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/34
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a test structure for determining dielectric breakdown events of a metallization system of semiconductor devices, a built-in compliance functionality may allow reliable switching off of the test voltage prior to causing high leakage currents, which may conventionally result in significant damage. Consequently, further failure analysis may be possible after the occurrence of a dielectric breakdown event.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.