Patent · US Active

Built-in compliance in test structures for leakage and dielectric breakdown of dielectric materials of metallization systems of semiconductor devices

US8314625B2 · kind B2 · utility

0Cited by
5References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 18, 2009
Grant dateNov 20, 2012
Priority date
Expiry dateFeb 6, 2031

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L22/34
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

In a test structure for determining dielectric breakdown events of a metallization system of semiconductor devices, a built-in compliance functionality may allow reliable switching off of the test voltage prior to causing high leakage currents, which may conventionally result in significant damage. Consequently, further failure analysis may be possible after the occurrence of a dielectric breakdown event.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.