Method for manufacturing a semiconductor component
US8324026B2 · kind B2 · utility
1Cited by
9References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2011 |
| Grant date | Dec 4, 2012 |
| Priority date | — |
| Expiry date | Jul 26, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor component having wetable leadframe lead surfaces and a method of manufacture. A leadframe having leadframe leads is embedded in a mold compound. A portion of at least one leadframe lead is exposed and an electrically conductive material is formed on the exposed portion. The mold compound is separated to form singulated semiconductor components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.