Semiconductor chip assembly with ceramic/metal substrate
US8324653B1 · kind B1 · utility
7Cited by
57References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2010 |
| Grant date | Dec 4, 2012 |
| Priority date | — |
| Expiry date | May 25, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an insulative material. The heat spreader includes a base and a ceramic block. The conductive trace provides signal routing between a pad and a terminal. The insulative material extends between the base and the terminal. The ceramic block is embedded in the base. The semiconductor device overlaps the ceramic block, is electrically connected to the conductive trace and is thermally connected to the heat spreader.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.