Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump
US8324723B2 · kind B2 · utility
7Cited by
55References
65Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2010 |
| Grant date | Dec 4, 2012 |
| Priority date | — |
| Expiry date | Jul 27, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/856
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a bump that includes first, second and third bent corners that shape a cavity. The conductive trace includes a pad and a terminal. The semiconductor device is located within the cavity, is electrically connected to the conductive trace and is thermally connected to the bump. The bump extends into an opening in the adhesive and provides a recessed die paddle and a reflector for the semiconductor device. The conductive trace provides signal routing between the pad and the terminal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.