Method for releasing a microelectronic assembly from a carrier substrate
US8327532B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2009 |
| Grant date | Dec 11, 2012 |
| Priority date | — |
| Expiry date | Aug 16, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53174
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for forming a microelectronic assembly (82) are provided. In one embodiment, the method includes providing a device substrate (50) having a plurality of electronic components (42) coupled thereto, and providing a carrier substrate (54) having first and second opposing surfaces (60, 62) and including a plurality of openings (58) extending between the first and second opposing surfaces (60, 62) and a plurality of depressions (64) formed on the first opposing surface (60). The method further includes attaching the device substrate (50) to the first opposing surface (60) of the carrier substrate (54) using an adhesive material (56) such that at least some of the adhesive material (56) is adjacent to at least some of the plurality of depressions (64), and removing the device substrate (50) from the carrier substrate (54).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.