Patent · US Active

Transfer device for receiving and transferring a solder ball arrangement

US8328068B2 · kind B2 · utility

4Cited by

6References

10Claims

0Family size

Assignees

Pac Tech—Packaging Technologies Gmbh · DE
Smart Pac GmbH Technology Services · DE

Inventors

Ghassem Azdasht · Berlin, DE
Siavash Tabrizi · Berlin, DE

Key dates

Filing date	Apr 17, 2008
Grant date	Dec 11, 2012
Priority date	—
Expiry date	Apr 17, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH05K3/3478
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

The present invention relates to a transfer device (10) for receiving and transferring a solder ball arrangement (28). Said transfer device comprises a discharge container (11) and a transfer substrate (12) that interacts with the discharge container in order to obtain a flat solder ball arrangement and that can be subjected to a negative pressure. The discharge container comprises an at least partially perforated base wall (14) and the transfer substrate has a hole pattern for receiving the solder ball arrangement. The discharge container comprises an ultrasound device (37) for subjecting said discharge container to ultrasound vibrations.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.