In vacuum optical wafer heater for cryogenic processing
US8328494B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2009 |
| Grant date | Dec 11, 2012 |
| Priority date | — |
| Expiry date | Jul 13, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67196
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A vacuum assembly used for warming processed substrates above the dew point to prevent unwanted moisture on the processed substrate surfaces as well as reducing negative impact on manufacturing throughput. The vacuum assembly includes a processing chamber, a substrate handling robot, and a heater which may be an optical heater. The processing chamber is configured to cryogenically process one or more substrates. The transfer chamber is connected to the processing chamber and houses the substrate handling robot. The substrate handling robot is configured to displace one or more substrates from the processing chamber to the transfer chamber. The heater is connected to the transfer chamber above the substrate handling robot such that the heater emits energy incident on the substrate when the substrate handling robot displaces the substrate in the transfer chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.