Film forming apparatus and method
US8328943B2 · kind B2 · utility
2Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2007 |
| Grant date | Dec 11, 2012 |
| Priority date | — |
| Expiry date | Aug 6, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/0291
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A film forming apparatus includes a processing chamber inside which a vacuum space is maintained and to which a film forming gas is supplied, a substrate supporting unit which is disposed inside the processing chamber and supports a substrate, and a heater which is made of a compound material comprising a high-melting point metal and carbon, is disposed inside the processing chamber, and heats the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.