Apparatus and methods for enhanced fluid delivery on bevel etch applications
US8328980B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 4, 2009 |
| Grant date | Dec 11, 2012 |
| Priority date | — |
| Expiry date | Apr 9, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/0318
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus to supply a plurality of process fluids for processing a substrate in a semiconductor processing chamber is disclosed. The apparatus includes a plurality of process fluid supply valves and a fluid supply network that is defined between a crossover valve and a tuning supply valve. The apparatus further includes a tuning fluid supply being connected to the fluid supply network through the tuning supply valve. Further included with the apparatus is a plurality of process fluids that are connected to the fluid supply network through the plurality of process fluid supply valves. A process chamber that has a substrate support is also included in the apparatus. The process chamber further including an edge fluid supply and a center fluid supply, the edge fluid supply connected to the fluid supply network through an edge enable valve and the center supply connected to the fluid supply network through a center enable valve. Wherein the crossover valve, edge enable valve, and center enable valve allow one of tuning fluid or process fluids to flow to one of the edge fluid supply or the center fluid supply.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.