Method for producing a capping wafer for a sensor

US8329555B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Frank Reichenbach · Wannweil, DE
• Franz Laermer · Stuttgart, DE
• Silvia Kronmueller · Schwaikheim, DE
• Andreas Scheurle · Leonberg, DE

Key dates

• Filing date: Oct 20, 2008
• Grant date: Dec 11, 2012
• Expiry date: Jan 15, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/1461
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method for producing a capping wafer for a sensor having at least one cap includes: production of a contacting via extending through the wafer, and, temporally subsequent thereto, filling of the contacting via with an electrically conductive material.