Package structure and package process of light emitting diode
US8330178B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 2010 |
| Grant date | Dec 11, 2012 |
| Priority date | — |
| Expiry date | Mar 3, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/882
Abstract
A light emitted diode (LED) package structure and an LED package process are provided. The LED package structure comprises a carrier, a spacer, at least one LED chip, a junction coating, a plurality of phosphor particles, and an encapsulant. The spacer is disposed on the carrier and provided with a reflective layer covering a top surface of the spacer. The LED chip is disposed on the reflective layer and electrically connected to the carrier. The junction coating is disposed over the spacer and covers the LED chip. The phosphor particles are distributed within the junction coating. The encapsulant is disposed on the carrier and encapsulates the LED chip, the spacer and the junction coating. Uniform light output and high illuminating efficiency can be obtained by the phosphor particles uniformly distributed in the junction coating. The junction coating is formed by package level dispensing process to reduce the fabrication cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.