Patent · US Active

Metal plating compositions

US8337688B2 · kind B2 · utility

7Cited by

4References

5Claims

0Family size

Assignee

Rohm and Haas Electronic Materials LLC · US

Inventors

Erik Reddington · Ashland, US
Gonzalo Urrutia Desmaison · Berlin, DE
Zukra I. Niazimbetova · Westborough, US
Donald E. Cleary · Littleton, US
Mark Lefebvre · Hudson, US

Key dates

Filing date	Aug 15, 2011
Grant date	Dec 25, 2012
Priority date	—
Expiry date	Aug 15, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH05K3/423
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.