Thin multi-chip flex module
US8345431B2 · kind B2 · utility
2Cited by
15References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2008 |
| Grant date | Jan 1, 2013 |
| Priority date | — |
| Expiry date | Dec 29, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49179
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multichip module comprises a flexible circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The flexible circuit is enclosed and supported by two rigid frames, which may further be provided with protective heat spreading covers. Contact pads on the rigid frame(s) may be configured to engage a mating socket or they may be solderable to a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.