Asymmetric MIM capacitor for DRAM devices
US8349696B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2011 |
| Grant date | Jan 8, 2013 |
| Priority date | — |
| Expiry date | Aug 1, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B12/30
Abstract
A bilayer second electrode for a MIM DRAM capacitor is formed wherein the layer of the electrode that is in contact with the dielectric layer (i.e. bottom layer) has a composition that is resistant to oxidation during subsequent anneal steps and have rutile templating capability. Examples include SnO2 and RuO2. The capacitor stack including the bottom layer is subjected to a PMA treatment to reduce the oxygen vacancies in the dielectric layer and reduce the interface states at the dielectric/second electrode interface. The other component of the bilayer (i.e. top layer) is a high work function, high conductivity metal or conductive metal compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.